Automation Machinery
CSP LED Taping Machine
CSP LED 테이핑기
The CSP taping machine rapidly tapes micro-sized, high-performance LED packages—known as Chip Scale Packages (CSPs)—onto carrier tape for SMT processes.
By miniaturizing conventional LEDs without compromising power, it enables more compact and lightweight lighting solutions. This equipment efficiently handles LED chips directly from the wafer, optimized for high-speed taping.
Specifications
| 구분 | 사양 |
|---|---|
| Index Time |
0.27sec/pcs
|
| Taping Accuracy |
X,Y=25μm Under
|
| Chip Size |
0.12 × 0.12 ~ 4 × 4mm, 0.1~3.5mm(T)
|
| Taping Force |
20~300g ( Digital Setting )
|
| Vision |
ZOOM LENS (0.5X)
|
| Wafer Type |
BIN Plate & Wafer Ring
|
| Wafer Loading |
Automatic Cassette & Transfer
|
