Advanced Material Machinery
Sheet Plating Machine
시트 도금기
Used for Cu plating treatment of PCB and Glass PCB substrates, consisting of the following processes: Load/Unload, Degreasing, Rinsing, Acid Cleaning, and Plating.
Specifications
| 구분 | 사양 |
|---|---|
| Product Size |
515mm*615mm(Negotiable)
|
| Plating Thickness Deviation |
Min. 10㎛ ~ Max. 20㎛ ±3%
|
| Manual Process & Plating Tank |
Quantity and Size(Negotiable)
|
| Current |
Rectifier configuration applied to customer specifications(Negotiable)
|
